An agile manufacturer must posess the capabilities, technologies, and adaptability to respond to unexpected environmental changes. |
EQUIPMENT WE USE Flexible, reliable, and well maintained equipment with state-of-the-art software is critical to producing high quality circuit boards at a great price. At Agility Mfg we are constantly seeking out new capital equipment that will fit with our goals and philosophy. All of the equipment we use for the manufacture of ROHS and NON-ROHS products are isolated to prevent contamination of ROHS assemblies. We have a many various equipment types which are needed to handle the large range of tasks in our production environment. MyData Pick and Place– Generally accepted as the easiest and most flexible machines in the industry to program and change over. Hydra speed mount heads make them incredibly fast as well as accurate. High resolution cameras allow accurate, repeatable mounting of ultra fine-pitch components. Smart feeders allow quick and easy breakdown and setup of jobs. Our newest aquisitions include a highspeed line consisting of 2 Mydata TP-11UFP machines connected and running in tandem. This also gives us large board and backplane capabilities.
Universal Insertion Machines– We have automated insertion machines for both DIP and Axial leaded through hole components. This allows us to build through hole and mixed technology boards fast and accurately.
Solder Reflow Ovens – We have dedicated ovens for both ROHS and NON-ROHS production.
Screen Printers-The MPM UltraPrint systems are industry leader in reliable, automated stencil printing. Its flexible, modular design ensures adaptability to various board types, and its patented alignment system provides superior accuracy and repeatability. A good assembly starts with perfect paste. This machine stores individual job parameters which make change-overs quick and easy. Additionally, we have semi-automatic and manual screen printers in order to screen multiple jobs simultaneously. We've also recently added a SMT 2444BAM printer which gives us the capability to print boards up to 24 x 44 inches!
Automatic Optical Inspection (AOI)- These machines optically inspect every board after they are assembled to ensure that component placement and solder joints are right every time. Mirtec and Viscom are both top choices in the AOI industry.
Scienscope Lead Free Wave Solder – Completely software driven, this brand new technology allows for precise thermal profiling so that each unique board has perfect thru-hole solder joints. Stores all process parameters and automatically adjusts itself for a quick and reapeatable setup. Our Hollis wave is used solely for lead process.
Automated Production Equipment BGA Rework System – Ease of programming, ease of use, accuracy, and flexibility distinguish the A.P.E system from many of the more complicated BGA rework systems on the market.
Additional Equipment used in the Manufacture of Printed Circuit Boards
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