Agility implies an innate strength that allows an enterprise to move quickly and efficiently in order to overcome obstacles.

PRINTED CIRCUIT BOARD ASSEMBLY

Printed Circuits

  • Automated Insertion of Thru-hole, SMT, or Mixed technology
  • Prototypes and Fast Turns
  • Large size boards and backplanes up to 30 x 20 inches
  • Panels, Multilayer, and odd shaped boards

 

Components

  • Automated SMT placement down to 8 mil pitch and 4 mil lead width
  • BGA and Micro BGA placement and rework to 12 mil pitch and 6 mil ball diameter
  • SMT Component range from 0402 chips up to 76 x 66 mm size parts
  • Connectors, Jacks, Fans etc..
  • Device programming

 

Soldering

  • Manual placement, soldering, and rework
  • Isolated lead and lead-free soldering process
  • ECO’s and manual assembly
  • Prototype specialists for quick turns
  • Wave soldering both manual and automated
  • Wire/Cable preparation and soldering

 

Chemistry

  • No-lead ROHS 5 and ROHS 6 compliance     
  • Traditional 63/37 leaded (eutectic) assembly
  • SAC 305 used for ROHS soldering
  • Water soluble, No Clean, and Rosin Fluxes
  • Conformal Coating

 

 

CAGE / NCAGE#
4QK13

ROHS

PBFree

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